Nagoya University

Joint Usage / Research Center

IMaSS has been designated by the Ministry of Education, Culture, Sports, Science and Technology (MEXT) as a "joint Usage/Research Center of materials and systems for innovative energy management." Through joint usage and research related to energy management technologies, it serves as a venue for everything from fundamental research through to system-building for actual deployment in society, aimed at more advanced, fully optimized energy creation, conversion, storage, transmission and utilization. At this facility, researchers from universities, research institutions and other organizations based in Japan and abroad can engaged in joint research together with IMaSS personnel while utilizing a wide range of equipment including film-deposition systems, micro/nano-fabrication equipments, electron microscopes and many other types of analysis instruments, and more. If you wish to apply for joint usage or research at this facility, please consult with the IMaSS staff in advance and apply at the beginning of the academic year.

Facilities and Equipment

  • [Coating Equipment]
    Facilities and Equipment Specifications Inquiry
    magnetron sputtering with 8 sources Magnetron sputtering with 8 sources 8 cathodes with 2 inches
    Sample size : 30x30 mm2
    RF power sources : 500 W x 2
    Sample heating : <600˚C
    Ar ion etching source : <1 kV
    Sample exchange chamber with 8 samples banking
    Nano fabrication Platform
    info*@*nanofab.engg.nagoya-u.ac.jp
    MBE with 8 sources MBE with 8 sources E-beam souces : 4cc x 4 and 2cc x 2
    Sample size : 30x30 mm2
    High voltage power souces : 3
    Sample heating : <1000˚C
    Ar ion etching source : <1 kV
    RHEED with 25 kV
    Nano fabrication Platform
    info*@*nanofab.engg.nagoya-u.ac.jp
    Magnetron sputtering with 3 sources Magnetron sputtering with 3 sources Shimadzu HSR-522
    3 cathodes with 4 inches
    RF power sources : 500 W x 2
    Reverse sputtering of sample, Sample rotation, Multi-layered deposition
    Nano fabrication Platform
    info*@*nanofab.engg.nagoya-u.ac.jp
  • [Microfabrication/Processing Device]
    Facilities and Equipment Specifications Inquiry
    Electron beam lithography Electron beam lithography JEOL JBX6300FS
    Accelerating voltage:25/50/100kV
    Minimum beam diameter:2nm
    Beam current:100pA-2nA
    Superimposing Accuracy:±9nm
    Maximum sample size:8inchφ
    Nano fabrication Platform
    info*@*nanofab.engg.nagoya-u.ac.jp
    Mask aligner Mask aligner Canon PLA-501(S)
    Indefinite shape sample with thickness less than 0.7μm
    Nano fabrication Platform
    info*@*nanofab.engg.nagoya-u.ac.jp
    ECR etching with SIMS ECR etching with SIMS ECR ion source:Irie Koken RGB-114
    Microwave input power:150 W,
    Accelerating voltage:600 V,Ion beam diameter:30mm
    SSIMS analyzer:PFEIFFER EDP400
    Mass analysis range:1-512 amu
    Sample rotation and tilting mechanism
    Nano fabrication Platform
    info*@*nanofab.engg.nagoya-u.ac.jp
    Ion implantation Ion implantation NISSIN Electric NH-20SR-WMH
    Accelerating voltage:5-200kV
    Beam current:1 µA~100 µA
    Nano fabrication Platform
    info*@*nanofab.engg.nagoya-u.ac.jp
    Femto-second laser for micro-fabrication and measurement Femto-second laser for micro-fabrication and measurement Kisou UFL-Hybrid System
    Pulse Laser:1041 nm, 550 fs, 10 µJ (IMRA µjewel D-1000)
    Harmonic generator:40% @520 nm, 5% @347 nm
    (Micro-fabrication Station)
    Maximum sample size:100 mm x 100 mm
    Laser beam diameter for fabrication:3.5 µmφ
    (Measurment Station)
    Time resolved fluorescent, Spin dynamics of magnetic materials
    (Optical Coherence Tomography Station)
    Observation area:10 mm x 10 mm x 1.6 mm
    Depth resolution:7 µm
    Nano fabrication Platform
    info*@*nanofab.engg.nagoya-u.ac.jp
    Electric furnace Electric furnace Koyo Thermo System Co. MODEL272-2
    Temperature range:400-1100˚C
    Nano fabrication Platform
    info*@*nanofab.engg.nagoya-u.ac.jp
    Rapid thermal annealing Rapid thermal annealing AG Associates Heatpulse 610
    Temperature range:400~1200˚C
    Temperature rasing rate:200˚C/sec
    Nano fabrication Platform
    info*@*nanofab.engg.nagoya-u.ac.jp
  • [Electronic Microscope & Associated Equipment]
    Facilities and Equipment Specifications Inquiry
    Reaction science high voltage scanning TEM Reaction science high voltage scanning TEM
    JEM1000K RS
    Acc. Vol.: 1000 kV (400, 600, 800 kV on demand)
    Electron gun: Thermal (LaB6)
    Mode: TEM/STEM
    Anal. Tool: GIF (Quantum equivalent)
    Recording: CCD (wide and high-res.)
    Specimen holder: cooling, heating, cryo-transfer, nano-indentation, 3D tomography, other custom-made holders
    E-cell: O2, N2, CO, H2,… up to 10,000 Pa
    High voltage electron microscope laboratory
    hvem*@*nagoya-microscopy.jp
    Aberration corrected scanning TEM Aberration corrected scanning TEM
    JEM ARM200F
    Acc. Vol.: 200 kV, 80 kV
    Electron gun: Cold FEG
    Mode: TEM/STEM
    Cs correction: probe
    Anal. Tool: EDX (SDD: 100 mm2), GIF Quantum
    Recording: CCD
    Specimen holder: single-tilt, double-tilting, double-tilting Be analytical
    Others: Diffraction imaging
    High voltage electron microscope laboratory
    hvem*@*nagoya-microscopy.jp
    Aberration corrected scanning TEM Aberration corrected scanning TEM
    JEM-10000BU
    Acc. Vol.: 200 kV, 80 kV
    Electron gun: Schottky FEG
    Mode: TEM/STEM
    Cs correction: probe & imaging
    Anal. Tool: EDX (SDD: 60 mm2), GIF Quantum
    Recording: CCD
    Specimen holder: single-tilt, double-tilting, double-tilting Be analytical
    Others: Bi-prism for holography, BSI detector
    High voltage electron microscope laboratory
    hvem*@*nagoya-microscopy.jp
    Transmission electron microscope Transmission electron microscope
    JEM2100F-HK
    Acc. Vol.: 200kV
    Electron gun: Schottky FEG
    Mode: TEM/STEM
    Anal. Tool: EDX (SDD: 60 mm2)
    Recording: CCD
    Specimen holder: double-tilting cooling, double-tilting heating, multi-sample, Be analytical
    High voltage electron microscope laboratory
    hvem*@*nagoya-microscopy.jp
    Transmission electron microscope Transmission Electron Microscope
    JEM-2100plus
    High voltage electron microscope laboratory
    hvem*@*nagoya-microscopy.jp
    Electron Spectroscopic scanning TEM Electron Spectroscopic scanning TEM
    JEM2100M
    Acc. Vol.: 80-200 kV
    Electron gun: Thermal (LaB6)
    Mode: TEM/STEM
    Anal. Tool: EDX (SDD: 30 mm2), WDX, EELS (Enfina), CL
    Recording: CCD
    Specimen holder: single-tilt, double-tilting, double-tilting Be analytical, rotation, cooling & heating
    Others: BSI detector
    High voltage electron microscope laboratory
    hvem*@*nagoya-microscopy.jp
    FIB-SEM High-speed sample fabrication/analysis system
    MI-4000L
    Acc vol.:30kV (FIB, SEM)
    Anal. Tool: FE-SEM、EDS, EDSD
    Micro-sampling, Slice & See
    High voltage electron microscope laboratory
    hvem*@*nagoya-microscopy.jp
    Focused ion beam sample preparation system Focused ion beam sample preparation system
    FB-2100
    Acc vol.:40kV
    Micro-sampling
    High voltage electron microscope laboratory
    hvem*@*nagoya-microscopy.jp
    Precision ion beam milling system Precision ion beam milling system
    PIPS II
    Ion energy: 100 eV~8 keV
    Attachments: Digitally zooming microscope, specimen cooling stage
    High voltage electron microscope laboratory
    hvem*@*nagoya-microscopy.jp
    Other instruments for sample preparation Other instruments for sample preparation Low speed blade saw, wire saw, mechanical lapping system, jet polishing (EcoPol), ultramicrotomy, Cross-section polisher, Dimpling machine, Gentle mill, ion coating machine, etc High voltage electron microscope laboratory
    hvem*@*nagoya-microscopy.jp
    3D electron microscope 3D electron microscope FEI Tecnai G2 300kV Saitoh Koh Laboratory
    Field-emission scanning electron microscope Field-emission scanning electron microscope JEOL JSM-6330F & JED-2140GS Shared Equipment Office
    shared.equip*@*imass.nagoya-u.ac.jp
    FE-SEM FE-SEM JEOL JSM-6301F
    Field-emission electron gun
    Accelerating voltage: 0.5~30kV
    Magnification: 10~500,000
    Analysis with energy dispersive X-ray spectrometry
    Nano fabrication Platform
    info*@*nanofab.engg.nagoya-u.ac.jp
  • [Analysis Measurement Equipment]
    Facilities and Equipment Specifications Inquiry
    X-ray diffractometer X-ray diffractometer RIGAKU ATX-G
    X-ray sourse : Cu-Ka, 18kW
    Multilayered focusing mirror
    Ge monochromater
    θ-2θscan mode,Rocking curve,Reciprocal lattice mapping, In-plane φ scan,φ-2θχscan
    Nano fabrication Platform
    info*@*nanofab.engg.nagoya-u.ac.jp
    X-ray diffractometer X-ray diffractometer RIGAKU RINT2500TTR Shared Equipment Office
    shared.equip*@*imass.nagoya-u.ac.jp
    Atomic force microscope Atomic force microscope Bruker, AXS Dimension3100
    Scan range:XY axes 90μm,Z axis 6μm
    Maximum sample size:150 mmφ-12mmt
    Measurement mode :  AFM,MFM,EFM,LFM,surface electric potential image,current image,lithography
    Nano fabrication Platform
    info*@*nanofab.engg.nagoya-u.ac.jp
    Magnetometers Magnetometers Alternative gradient force magnetometer, sensitivity :10^-8emu,maximum field : 20kOe
    Vibrating sample magnetometer, sensitivity :10^-5emu,maximum field : 15kOe
    Torque magnetometer:sensitivity :2×10^-3erg,maximum field : 15kOe
    Magneto-optical spectrometer, sensitivity :2×10^-3deg,maximum field : 16kOe
    Nano fabrication Platform
    info*@*nanofab.engg.nagoya-u.ac.jp
    X-ray photoelectron spectrometer X-ray photoelectron spectrometer VG ESCALAB250
    Mg/Al twin anode and Al monochromator
    X ray source
    Sample etching by Ar ion gun
    Manipultor for angle resolved measurement
    Nano fabrication Platform
    info*@*nanofab.engg.nagoya-u.ac.jp
    X-ray photoelectron spectrometer X-ray photoelectron spectrometer SHIMADZU ESCA-3300 Shared Equipment Office
    shared.equip*@*imass.nagoya-u.ac.jp
    ICP atomic emission spectrometer Inductively Coupled Plasma Atomic Emission Spectrometer Seiko Instruments, SPS7800 Shared Equipment Office
    shared.equip*@*imass.nagoya-u.ac.jp
    CHN coder CHN coder (Yanaco) MT-6 Shared Equipment Office
    shared.equip*@*imass.nagoya-u.ac.jp
    Test apparatus of electrically driven small centrifugal compressor Test apparatus of electrically driven small centrifugal compressor Tx40MS Shared Equipment Office
    shared.equip*@*imass.nagoya-u.ac.jp
    Liquid chromatograph/mass spectrometer Liquid chromatograph/mass spectrometer Micromass LCT Shared Equipment Office
    shared.equip*@*imass.nagoya-u.ac.jp
    Laser doppler velocimeter for one velocity component Laser doppler velocimeter for one velocity component 1D-PDPA/FSA3500P Shared Equipment Office
    shared.equip*@*imass.nagoya-u.ac.jp

    Please drop *'s before/after @ in sending e-mail.

  • [Center for Integrated Research of Future Electronics / Center for Integrated Research of Future Electronics, Transformative Electronics Facilities]
    Facilities and Equipment Specifications Inquiry
    Ion implanter
    ULVAC IMX-3500
    C-TEFs
    c-tefs*@*imass.nagoya-u.ac.jp
    i-line stepper
    Nikon NSR-2205i12D
    C-TEFs
    c-tefs*@*imass.nagoya-u.ac.jp
    Nano inprint equipment
    SCIVAX X-500
    C-TEFs
    c-tefs*@*imass.nagoya-u.ac.jp
    Laser Confocal Microscope
    Olympus OLS-4100
    C-TEFs
    c-tefs*@*imass.nagoya-u.ac.jp
    RCA cleaning system
    Dalton 18-MR 12
    C-TEFs
    c-tefs*@*imass.nagoya-u.ac.jp
    Organic cleaning system
    Dalton 18-MU11
    C-TEFs
    c-tefs*@*imass.nagoya-u.ac.jp
    Stylus profiler
    Bruker Dektak XT-A
    C-TEFs
    c-tefs*@*imass.nagoya-u.ac.jp
    ICP etching system 4
    ULVAC CE-S
    C-TEFs
    c-tefs*@*imass.nagoya-u.ac.jp
    Atomic layer deposition system
    (Plasma/Thermal)
    Ultratech/CambridgeNanoTech Fiji G2
    C-TEFs
    c-tefs*@*imass.nagoya-u.ac.jp
    Low pressure CVD system
    samco LPD-1200
    C-TEFs
    c-tefs*@*imass.nagoya-u.ac.jp
    ICP etching system 1
    samco RIE-200iP
    C-TEFs
    c-tefs*@*imass.nagoya-u.ac.jp
    ICP etching system 2
    samco RIE-200iP
    C-TEFs
    c-tefs*@*imass.nagoya-u.ac.jp
    Plasma CVD 1
    samco PD-220NL
    C-TEFs
    c-tefs*@*imass.nagoya-u.ac.jp
    ICP etching system 3
    ULVAC NE-550EX
    C-TEFs
    c-tefs*@*imass.nagoya-u.ac.jp
    EB evaporator
    ULVAC ei-5
    C-TEFs
    c-tefs*@*imass.nagoya-u.ac.jp
    Sputtering system
    ULVAC CS-L
    C-TEFs
    c-tefs*@*imass.nagoya-u.ac.jp
    Automated Thickness Mapping Systems
    FILMETRICS F50
    C-TEFs
    c-tefs*@*imass.nagoya-u.ac.jp
    West bond 7200CR HONDA, Assoc. Prof.
    TECDIA TEC-2004TMR HONDA, Assoc. Prof.
    High Temperature Sputtering Deposition Equipment
    ULVAC QAM4
    HONDA, Assoc. Prof.
    FIB-SEM
    HITACHI NX2000
    HONDA, Assoc. Prof.
    In-lens SEM
    HITACHI SU9000
    HONDA, Assoc. Prof.
    Imaging CL
    HORIBA WD201N
    HONDA, Assoc. Prof.
    Work function measuring device
    RIKEN KENKI AC-3
    HONDA, Assoc. Prof.
    Emission microscope
    HAMAMATSU PHOTONICS
    PHEMOS-1000
    HONDA, Assoc. Prof.
    Nanofactor Fact-200 HONDA, Assoc. Prof.
    West bond 7476D HONDA, Assoc. Prof.